The thin 6 F Tendril STS lead is designed to deliver reliable performance through a unique soft silicone tip technology that can reduce lead tip pressure. The proprietary St. Jude Medical Optim® lead insulation featured on the Tendril STS lead offers a minimized risk of lead abrasion and provides long-term durability.
Soft Silicone Tip For More Compliance At The Lead-endocardium Interface
Increase implant safety while taking advantage of the clinical benefits of thin-profile leads with the Tendril STS lead’s soft silicone tip design. The Tendril STS lead provides:
- A tip pressure reduction of 30% (mean) over 6 F leads without a soft silicone tip1
- An increase in lead tip surface area of 35% over 6 F leads without a soft silicone tip
- Compatibility with a 6 F introducer due to the tip material’s soft nature
Thin Lead Body For Safer and Easier Venous Introduction
Ease implantation with the small diameter lead, compatible with a 6 F introducer. The thin profile is designed to:
- Improve venous passage
- Accommodate additional leads within a single vessel
- Reduce the risk of rib-clavicle crush and venous thrombosis
- Provide more options for lead access in a small cephalic vein
Optim Lead Insulation For Long-term Durability
Minimize lead abrasion with the exclusive, award-winning* St. Jude Medical Optim lead insulation, a unique hybrid material that:
- Blends the biostability and flexibility of silicone with the durability and lubricity of polyurethane
- Provides abrasion-resistance to minimize the risk of lead-on-lead and lead-on-can abrasion in multi-lead systems2
- Offers flexibility and lubricity for improved handling2
* Optim lead insulation was named Biomaterial of the Month by the Society for Biomaterials (SFB), April 30, 2009. SFB is a professional society that promotes advances in biomedical materials research and development.
1 Bench testing data on file
2 Jenney C, Tan J, Karicherla A, Burke J, Helland J. A new insulation material for cardiac leads with potential for improved performance. Heart Rhythm 2005; 2:S318-S319.